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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Simulation and Optimization of High Performance On-Chip Solenoid MEMS Inductor
Zhou, Shengrui, Xu, Ling, Lu, Jicun, Yang, YinglinYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480563
File:
PDF, 4.79 MB
english, 2018