Large-area die-attachment by silver stress migration bonding for power device applications
Noh, Seungjun, Zhang, Hao, Yeom, Jeyun, Chen, Chuantong, Li, Caifu, Suganuma, KatsuakiVolume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.131
Date:
September, 2018
File:
PDF, 1.72 MB
english, 2018