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Optimizing curing process of graphene oxide/waterborne epoxy blends by curing kinetics simulation considering the coupling of heat conduction and curing reaction
Wang, Zhiwei, Liu, Lijia, Zhang, Jin, Cao, Liying, Dong, Hongxing, Zhang, Chunhong, Xu, Xin, Zhu, Mingxin, Li, JunqingVolume:
672
Language:
english
Journal:
Thermochimica Acta
DOI:
10.1016/j.tca.2018.12.016
Date:
February, 2019
File:
PDF, 5.10 MB
english, 2019