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[IEEE 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Austin, TX, USA (2018.9.24-2018.9.26)] 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Investigation of the Dynamic Thermal Characteristic in Bulk FinFET
Chen, Zhanfei, Liu, Jun, Zhen, Jiachen, Sun, LinglingYear:
2018
Language:
english
DOI:
10.1109/SISPAD.2018.8551664
File:
PDF, 246 KB
english, 2018