Representative volume element analysis for wafer-level...

Materials Science in Semiconductor Processing 2019 / 03 Vol. 91

Representative volume element analysis for wafer-level warpage using Finite Element methods

Baek, Jong Won, Yang, Woo Seok, Hur, Min Jae, Yun, Jin Chul, Park, Seong Jin
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Volume:
91
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2018.12.008
Date:
March, 2019
File:
PDF, 5.45 MB
english, 2019
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