[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Study on Electrochemical Migration of Sn-0.7Cu
Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil,, Wang, Yunpeng, Ma, HaitaoYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480719
File:
PDF, 4.33 MB
english, 2018