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A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package
Hang, Chunjin, Zhang, He, Tian, Yanhong, Wang, Chenxi, Huang, Yuan, Zheng, Zhen, Wang, ChunqingVolume:
8
Language:
english
Journal:
Applied Sciences
DOI:
10.3390/app8112188
Date:
November, 2018
File:
PDF, 3.41 MB
english, 2018