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[IEEE 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Portland, OR, USA (2018.9.23-2018.9.27)] 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Thermal Modeling and Sizing of PCB Copper Pads
Shen, Yanfeng, Wang, Huai, Blaabjerg, FredeYear:
2018
Language:
english
DOI:
10.1109/ECCE.2018.8558128
File:
PDF, 605 KB
english, 2018