[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Plasma Treatment Technology in Microwave PCB Manufacturing
Dai, Guangqian, Bian, Fangsheng, Zeng, Ce, Lin, Yumin, Gong, Xiaolin, Liu, ZhihuiYear:
2018
DOI:
10.1109/ICEPT.2018.8480434
File:
PDF, 4.21 MB
2018