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[IEEE 2018 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2018.12.1-2018.12.5)] 2018 IEEE International Electron Devices Meeting (IEDM) - A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging
Ezhilarasu, G., Hanna, A., Irwin, R., Alam, A., Iyer, S. S.Year:
2018
DOI:
10.1109/IEDM.2018.8614705
File:
PDF, 913 KB
2018