Surface Treatment of Copper Inner-layer with Electroless...

Surface Treatment of Copper Inner-layer with Electroless Copper Using Hypophosphite as a Reducing Agent.

HONMA, Hideo, FUJINAMI, Tomoyuki
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Volume:
6
Year:
1991
Journal:
Circuit Technology
DOI:
10.5104/jiep1986.6.4_209
File:
PDF, 5.01 MB
1991
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