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[IEEE 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Chiang Rai, Thailand (2018.7.18-2018.7.21)] 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Effect of Waiting Time to Void Under Die for Snap Cure Process in Integrated Packaging
Paktramook, Varunee, Ugsornrat, Kessararat, Sumithpibul, Chalermsak, Boonyaporn, PattYear:
2018
DOI:
10.1109/ECTICon.2018.8619956
File:
PDF, 7 KB
2018