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[IEEE 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Iasi, Romania (2018.10.25-2018.10.28)] 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Publication Techniques for Young Scientists in the Field of Microelectronic Engineering
Illes, Balazs, Busek, David, Fodor, Alexandra, Skwarek, Agata, Krammer, Oliver, Geczy, Attila, Dusek, KarelYear:
2018
DOI:
10.1109/SIITME.2018.8599245
File:
PDF, 9 KB
2018