Adhesion and Material Properties between Polyimide and...

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Adhesion and Material Properties between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3D Integration

Lu, Cheng-Hsien, Kho, Yi-Tung, Chen, Chiao-Pei, Tsai, Bin-Ling, Chen, Kuan-Neng
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Year:
2019
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2895515
File:
PDF, 5 KB
2019
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