Adhesion and Material Properties between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3D Integration
Lu, Cheng-Hsien, Kho, Yi-Tung, Chen, Chiao-Pei, Tsai, Bin-Ling, Chen, Kuan-NengYear:
2019
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2895515
File:
PDF, 5 KB
2019