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Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant
Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Jung, Seung-BooVolume:
781
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2018.12.032
Date:
April, 2019
File:
PDF, 3.00 MB
english, 2019