[IEEE 2018 IEEE International Power Electronics and...

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[IEEE 2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC) - Shenzhen, China (2018.11.4-2018.11.7)] 2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC) - Mechanism Analysis of Bond Wire Degradation Leading to the Increase of IGBT Collector-Emitter Voltage

Jia, Yingjie, Duan, Yaoqiang, Xiao, Fei, Luo, Yifei, Liu, Binli, Deng, Hongfei
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Year:
2018
Language:
english
DOI:
10.1109/PEAC.2018.8590628
File:
PDF, 371 KB
english, 2018
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