[IEEE 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Stockholm, Sweden (2018.9.26-2018.9.28)] 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Improving Thermal Contact Conductance from Electronics Board to Rack Infrastructure
Terpstra, Jeroen, Wits, Wessel W.Year:
2018
Language:
english
DOI:
10.1109/THERMINIC.2018.8593281
File:
PDF, 466 KB
english, 2018