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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
Parameswaran, Suresh, Refai-Ahmed, Gamal, Ramalingam, Suresh, Ang, BoonYear:
2018
Language:
english
DOI:
10.1115/IPACK2018-8300
File:
PDF, 1.79 MB
english, 2018