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Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere-reinforced epoxy composite for electronic packaging application
Agrawal, Alok, Satapathy, AlokLanguage:
english
Journal:
Polymer Composites
DOI:
10.1002/pc.25050
Date:
January, 2019
File:
PDF, 658 KB
english, 2019