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Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive
Wang, Xiao-Qing, Gan, Wei-Ping, Xiang, Feng, Li, Bi-YuanLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-0559-y
Date:
January, 2019
File:
PDF, 2.31 MB
english, 2019