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IEEE Transactions on Components Packaging and Manufacturing Technology 2018

Process mean of tolerance settings of CPU components via CAE simulation and response surface methodology

Jeang, Angus, Ko, Chang Pu, Chung, Chien-Ping
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2879656
File:
PDF, 644 KB
english, 2018
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