Molecular investigations on grain filling rate under...

Molecular investigations on grain filling rate under terminal heat stress in bread wheat (Triticum aestivum L.)

Girish, Ch, ra, P, ey,, Jagadish, Rane, Sindhu, Sareen, Priyanka, Siwach, N K, Singh, Ratan, Tiwari
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Volume:
12
Year:
2013
Language:
english
Journal:
African Journal of Biotechnology
DOI:
10.5897/ajb12.2751
File:
PDF, 397 KB
english, 2013
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