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Molecular investigations on grain filling rate under terminal heat stress in bread wheat (Triticum aestivum L.)
Girish, Ch, ra, P, ey,, Jagadish, Rane, Sindhu, Sareen, Priyanka, Siwach, N K, Singh, Ratan, TiwariVolume:
12
Year:
2013
Language:
english
Journal:
African Journal of Biotechnology
DOI:
10.5897/ajb12.2751
File:
PDF, 397 KB
english, 2013