Fabrication of high-temperature-resistant bondline based on...

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Journal of Materials Science: Materials in Electronics 2019 / 1

Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices

Yu, Fuwen, Chen, Hongtao, Hang, Chunjin, Li, Mingyu
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-00637-7
Date:
January, 2019
File:
PDF, 2.37 MB
english, 2019
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