![](/img/cover-not-exists.png)
[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
Ankenbrand, Markus, Scheetz, Matthias, Franke, Joerg, Lomakin, Konstantin, Sippel, Mark, Gold, Gerald, Helmreich, KlausYear:
2018
Language:
english
DOI:
10.1109/ICMID.2018.8527052
File:
PDF, 437 KB
english, 2018