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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Modeling the Laser Ablation Process Using Neural Networks
Setia, Ronald, May, Gary S.Year:
2003
Language:
english
DOI:
10.1115/IPACK2003-35188
File:
PDF, 241 KB
english, 2003