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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration
Martins, A., Pinheiro, M., Ferreira, A. F., Almeida, R., Matos, F., Oliveira, J., oToole, Eoin, Santos, H. M., Monteiro, M. C., Gamboa, H., Silva, R. P.Year:
2018
Language:
english
DOI:
10.23919/IWLPC.2018.8573275
File:
PDF, 582 KB
english, 2018