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[IEEE 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao, China (2018.10.31-2018.11.3)] 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Voidless metal filling and elimination of metal diffusion in PVD barrier and seed process for high performance Cu interconnect
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Zuo, Qing-Yun, Wang, Wei-Jun, Li, Ming, Chen, Shou-Mian, Zhao, Yu-HangYear:
2018
Language:
english
DOI:
10.1109/icsict.2018.8564986
File:
PDF, 1.16 MB
english, 2018