![](/img/cover-not-exists.png)
[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Interconnect Reliability of Low Temperature Solder for Potential Application in Enterprise Computers, Portable, and Automotive Electronics
Wang, Dr. Paul, He, David, Cao, Vivi, Mai, Goterry, Song, Sy, Ge, Fred, Tan, KGYear:
2018
DOI:
10.1109/ICEPT.2018.8480825
File:
PDF, 9 KB
2018