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Manufacturing and DC characterization of conductive through wafer via for MEMS applications
Vasilache, Dan, Iordanescu, Sergiu, Avram, Andrei, Popescu, Marian, Avramescu, ViorelLanguage:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/1361-6641/aafe9c
Date:
January, 2019
File:
PDF, 2.83 MB
english, 2019