Microstructure evolution and grain orientation of IMC in...

Journal of Alloys and Compounds 2019 / 05 Vol. 786

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Sun, Lei, Chen, Ming-he, Zhang, Liang
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Volume:
786
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2019.01.384
Date:
May, 2019
File:
PDF, 4.16 MB
2019
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