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[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Component Packages for IMSE™ (Injection Molded Structural Electronics)
Simula, Tomi, Niskala, Paavo, Heikkinen, Mikko, Rusanen, OutiYear:
2018
Language:
english
DOI:
10.23919/nordpac.2018.8423845
File:
PDF, 346 KB
english, 2018