A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO3 nanomaterial
Zhang, Xuan, Zhang, Hong, Zheng, Xiujun, Walls, Michael, Peng, YongJournal:
Nanotechnology
DOI:
10.1088/1361-6528/ab030c
Date:
January, 2019
File:
PDF, 997 KB
2019