Synergistic Influence of Cu Intercalation on Electronic and...

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Journal of Electronic Materials 2019 / 1

Synergistic Influence of Cu Intercalation on Electronic and Thermal Properties of n-Type CuxBi2Te2.7Se0.3 Polycrystalline Alloys

Cho, Hyun-jun, Shin, Weon Ho, Choo, Sung-sil, Kim, Ji-il, Yoo, Joonyeon, Kim, Sang-il
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Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-06973-6
Date:
January, 2019
File:
PDF, 1.88 MB
english, 2019
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