The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing
Tian, Yu, Wang, Yishu, Guo, Fu, Ma, Limin, Han, JingLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-06907-8
Date:
January, 2019
File:
PDF, 2.21 MB
english, 2019