Synthesis of UV and thermal dual curing oligomer for solder...

Journal of Applied Polymer Science 2019 / 05 Vol. 136; Iss. 17

Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink-jet printing

Liang, Zhihao, Wang, Xiaomei, Feng, Liangting, Wu, Xuefen
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Volume:
136
Language:
english
Journal:
Journal of Applied Polymer Science
DOI:
10.1002/app.47428
Date:
May, 2019
File:
PDF, 916 KB
english, 2019
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