Die-Attach Materials for High Temperature Applications in Microelectronics Packaging (Materials, Processes, Equipment, and Reliability) || Sintered Copper (Cu): Chemistry, Process, and Reliability
Siow, Kim S.Volume:
10.1007/97
Year:
2019
Language:
english
DOI:
10.1007/978-3-319-99256-3_8
File:
PDF, 1.90 MB
english, 2019