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[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - High Reliability Wire-Less Power Module Structure
Chi, Wei-Hao, Chen, Hao-Chih, Liao, Hsueh-KuoYear:
2018
Language:
english
DOI:
10.1109/IMPACT.2018.8625789
File:
PDF, 7 KB
english, 2018