[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 2 - Reliability Analysis of Solderless Press-Fit Interconnections
Tohmyoh, Hironori, Yamanobe, Kiichiro, Saka, Masumi, Utsunomiya, Jiro, Nakamura, Takeshi, Nakano, YoshikatsuYear:
2007
DOI:
10.1115/IPACK2007-33264
File:
PDF, 405 KB
2007