[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics Interconnects
Liu, Li, Cui, Jinzi, Wang, Jing, Zhou, Zhaoxia, Johnson, R. Wayne, Liu, ChangqingYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.61
File:
PDF, 8 KB
english, 2017