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Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles
Simon, F.B., Letz, S.A., Schletz, A.Volume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.113
Date:
September, 2018
File:
PDF, 1.55 MB
english, 2018