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[IEEE 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) - Portland, OR, USA (2018.10.14-2018.10.17)] 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) - The First-Priniple Simulation Study on the Specific Grain Boundary Resistivity in Copper Interconnects
Lee, Jaehyun, Lamarche, Michel, Georgiev, Vihar P.Year:
2018
DOI:
10.1109/nmdc.2018.8605907
File:
PDF, 7 KB
2018