![](/img/cover-not-exists.png)
Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers
Liao, Bokai, Li, Zhen, Cai, Yu, Guo, XingpengLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-00858-4
Date:
February, 2019
File:
PDF, 2.64 MB
english, 2019