[IEEE IECON 2018 - 44th Annual Conference of the IEEE...

  • Main
  • [IEEE IECON 2018 - 44th Annual...

[IEEE IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society - D.C., DC, USA (2018.10.21-2018.10.23)] IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society - Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering

Buttay, Cyril, Riva, Raphel, Allard, Bruno, Locatelli, Marie-Laure, Bley, Vincent
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2018
DOI:
10.1109/IECON.2018.8591117
File:
PDF, 8 KB
2018
Conversion to is in progress
Conversion to is failed