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[IEEE 2018 International Conference on ReConFigurable Computing and FPGAs (ReConFig) - Cancun, Mexico (2018.12.3-2018.12.5)] 2018 International Conference on ReConFigurable Computing and FPGAs (ReConFig) - Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards
Fusiara, Paulina, Schoonderbeek, Gijs, Pragt, Johan, Hiemstra, Leon, Kuindersma, Sjouke, Schuil, Menno, Hampson, GrantYear:
2018
Language:
english
DOI:
10.1109/reconfig.2018.8641727
File:
PDF, 10 KB
english, 2018