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Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology
Hilleringmann, U., Assion, F., Vidor, F. F., Wirth, G. I.Volume:
1
Year:
2015
Language:
english
Journal:
Journal of Machine to Machine Communications
DOI:
10.13052/jmmc2246-137X.131
File:
PDF, 2.42 MB
english, 2015