Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films
Yi, Pan, Dong, Chaofang, Ji, Yucheng, Yin, Yupeng, Yao, Jizheng, Xiao, KuiJournal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-00964-3
Date:
March, 2019
File:
PDF, 2.05 MB
2019