Characterization of SiC Trench MOSFETs in a Low-Inductance...

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IEEE Transactions on Industry Applications 2019

Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package

Wang, Zhiqiang, Yang, Fei, Campbell, Steven, Chinthavali, Madhu
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Year:
2019
Journal:
IEEE Transactions on Industry Applications
DOI:
10.1109/TIA.2019.2902839
File:
PDF, 6 KB
2019
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