[IEEE 2018 19th International Conference on Electronic...

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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Signal Integrity Design For QSFP interface applicated in RF Optical transmitter Module

Ma, Pengcheng, Liu, Fenman, Zhao, Man, He, Huimin, Wei, Juan, Cao, Liqiang
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Year:
2018
DOI:
10.1109/ICEPT.2018.8480712
File:
PDF, 6 KB
2018
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