Integration of CMOS image sensor and microwell array using...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Integration of CMOS image sensor and microwell array using 3D WLCSP technology for bio-detector application

Zhao, Shuai, Yu, Daquan, Zou, Yichao, Yang, Chaodong, Yang, Xiaobing, Xiao, Zhiyi, Chen, Pei, Qin, Fei
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2899898
File:
PDF, 5 KB
english, 2019
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