Influence of thermal shock cycles on Sn-37Pb solder bumps

Gan, Guisheng, Xia, Da-quan, Liu, Xin, Liu, Cong, Cheng, Hanlin, Ming, Zhongzhen, Gao, Haoyang, Yang, Dong-hua, Wu, Yi-ping

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Language:

english

Journal:

Soldering & Surface Mount Technology

DOI:

10.1108/SSMT-08-2018-0026

Date:

February, 2019

File:

PDF, 857 KB

english, 2019

Conversion to is in progress

Conversion to is failed